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eBook Electronic Packaging of High Speed Circuitry download

by Arden R. Helland,Stephen G. Konsowski

eBook Electronic Packaging of High Speed Circuitry download ISBN: 0070359709
Author: Arden R. Helland,Stephen G. Konsowski
Publisher: McGraw-Hill Professional; 1 edition (May 1, 1997)
Language: English
Pages: 345
ePub: 1982 kb
Fb2: 1611 kb
Rating: 4.4
Other formats: azw mbr txt docx
Category: Engineering
Subcategory: Engineering

381/046 21. Personal Name: Konsowski, Stephen G. Publication, Distribution, et. New York Note: Includes bibliographical references and index. Personal Name: Helland, Arden R.

381/046 21.

A comprehensive guide to the packaging of high speed circuits for . Stephen G. Konsowski has 34 years of electronic packaging engineering experience.

A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. Rubrics: Electronic packaging Microwave devices Design and construction. Download now Electronic packaging of high speed circuitry Stephen G. Konsowski, Arden R. Helland ; drawings by Darnetta Anderson and Robert L. Thing, J. Download PDF book format. Download DOC book format.

Stephen G. Konsowski, Arden Helland. With the help of this expert guide, you can design and package the high-frequency circuitry crucial to the performance of todayOs advanced electronic products, such as Pentium chips, HDTV, and mobile communications. This book fully explains approaches that include basic signal transmission theory, digital and microwave circuit design, and how these are integrated with the packaging and interconnection characteristics

Start by marking Electronic Packaging of High Speed Circuitry as Want to Read .

Start by marking Electronic Packaging of High Speed Circuitry as Want to Read: Want to Read savin. ant to Read. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all th This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications.

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.

Konsowski, Stephen . and Helland, Arden . Electronic Packaging of High Speed Circuitry. eds) Robust Electronic Design Reference Book. Springer, Boston, MA. New York: McGraw-Hill, 1997, pp. 20, 2. oogle Scholar. Mardiguian, Michel, A Handbook Series on Electromagnetic Interference and Compatibility Volume 2: Grounding and Bonding.

This book fully explains approaches that include basic signal transmission theory, digital and microwave circuit design .

This book fully explains approaches that include basic signal transmission theory, digital and microwave circuit design, and how these are integrated with the packaging and interconnection characteristics. YouÕll find detailed coverage of signal behavior in both high speed digital and microwave circuits, as well as crucial aspects of materials selection and manufacturing. Library descriptions. Konsowski. Are you sure you want to remove Electronic packaging of high speed circuitry from your list?

Stephen G. 1 2 3 4 5. Want to Read. Are you sure you want to remove Electronic packaging of high speed circuitry from your list? Electronic packaging of high speed circuitry. by Stephen G. Published 1997 by McGraw-Hill in New York. Electronic packaging, Microwave devices, Design and construction. Includes bibliographical references and index. Electronic packaging and interconnection series.

Electronic Packaging of High Speed Circuitry. A high speed digital router spans clock rate gap by combining both classical digital and RF design disciplines. Multilayer processing. Digital functions include: merging words from multiple sources, converting the data from parallel words into serial bits, rate buffering to synchronize the data, optionally routing data through alternate paths such as cross strapping and/or routing the data to other units and maintaining extremely accurate timing synchronization (under 100 ps).

With the help of this expert guide, you can design and package the high-frequency circuitry crucial to the performance of todayÕs advanced electronic products, such as Pentium chips, HDTV, and mobile communications. This book fully explains approaches that include basic signal transmission theory, digital and microwave circuit design, and how these are integrated with the packaging and interconnection characteristics. YouÕll find detailed coverage of signal behavior in both high speed digital and microwave circuits, as well as crucial aspects of materials selection and manufacturing.
Comments: (2)
Runehammer
This book is broad on its coverage, but it treats the matters mostly at the qualitative level. So it is perhaps good for technicians and newcomers to the high speed/high frequency field but it misses the quantitative analysis and discussion needed to perform design of products and engineering. For instance, high frequency models of devices (e.g. at Spice level) accounting for packaging effects (e.g. wire bonding, etc...) are not discussed or even presented. As such I think that this was a wrong acquisition for me.
Centrizius
Only made it to 2nd chapter so far, but very informative in the understanding of the field for someone just beginning the world of high speed packaging with concise explanations.