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eBook Nanopackaging: Nanotechnologies and Electronics Packaging download

by James E. Morris

eBook Nanopackaging: Nanotechnologies and Electronics Packaging download ISBN: 0387473254
Author: James E. Morris
Publisher: Springer; 2009 edition (October 23, 2008)
Language: English
Pages: 543
ePub: 1146 kb
Fb2: 1774 kb
Rating: 4.3
Other formats: mobi azw lrf doc
Category: Engineering
Subcategory: Engineering

Nanotechnologies and Electronics Packaging.

Nanotechnologies and Electronics Packaging. This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive inks, underfill fillers, and solder enhancement.

Nanotechnologies are being applied to microelectronics packaging, primarily in the applications .

Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes.

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale .

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends.

Nanopackaging: Nanotechnologies and Electronics PackagingPaperback – 10 January 2019

Nanopackaging: Nanotechnologies and Electronics PackagingPaperback – 10 January 2019. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement.

and Electronics Packaging. We discuss how the properties of ICA can be engineered for electronic packaging in terms of material properties, conductive mechanisms, bulk conductivity, adhesion, reliability, and cost. Digital Object Identifier 1. 109/MNANO. We conclude with a discussion of commercial processes for ICA use in consumer electronics.

Start by marking Nanopackaging: Nanotechnologies and Electronics Packaging as Want to Read .

Start by marking Nanopackaging: Nanotechnologies and Electronics Packaging as Want to Read: Want to Read savin. ant to Read. This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends.

Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends.

Поиск книг BookFi BookSee - Download books for free. Nanopackaging: Nanotechnologies and Electronics Packaging. Practical Guide to the Packaging of Electronics,: Thermal and Mechanical Design and Analysis. Категория: Science, Nanostructures.

Автор: Morris James . Mallik Debendra Название: Nanopackaging, Nanotechnologies and .

cle{ingNA, title {Nanopackaging: nanotechnologies and electronics packaging}, author {J. E. Morris}, journal {Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. year {2006}, pages {199-205} }. .

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.